The MDA-600S is widely used for MEMS, LED and Semiconductor industry. It can provide a higher performance of alignment accuracy and resolution. It is an ideal and economical tool for Universities and Research Centers. For users of both thick high aspect ratio photoresists and thin high resolution photoresists: The MDA-600S can process from 0.8 um and high aspect ratio PR to approximately 170 um thickness without additional optics. That should suit users varying needs, without any system changes.
The Model MDA-600S is a semi-automatic bench top mask aligner that requires only a square meter of your cleanroom space. (1256 x 1151 x 1600 mm (W*D*H) ). It offers an economic alternative for R&D, or small-scale pilot production. It has a semi- automatic mask aligner system for 6” features auto exposure, leveling and Z-axis stage motion. The loading, unloading and aligning of your wafer is done manually.
The alignment module incorporates micrometers for X, Y, and Z-axis. Alignment accuracy is ± 0.5 µm.
This mask aligner is a flexible, economic solution for any entry-level mask alignment and UV exposure application.
Options
- Back-side Alignment Module (CCD camera)
(Optional CCD Optical BSA uses CCD camera only!) - Nanoimprint Kit
