The POLOS® Wafer Scriber is a compact, high-precision tool designed for laboratory wafer cutting with exceptional edge quality. Its ergonomic design ensures comfortable operation, while the adjustable pressure dial provides consistent and accurate scribing without relying on manual force. Users can select between carbide or diamond wheels to suit a wide variety of materials and cutting requirements.
Accurate and repeatable cutting
The system incorporates strong magnetic guides, allowing substrates to be cut repeatedly to the same dimensions with outstanding precision. Standard cutting accuracy is under 0.1 mm, and fine adjustments using a caliper can achieve ±50 μm for highly controlled results.
Compatible materials
The POLOS® Wafer Scriber is suitable for cutting a broad range of substrates, including:
- Glass and oxide-coated glass wafers (e.g., ITO, FTO, AZO)
- Quartz wafers, plates, slides, and coverslips
- Silicon wafers
- Sapphire wafers and substrates
- Other crystalline wafers and materials
Optional accessories
- Film-cutting head: Replace the standard wheel for delicate film processing.
- Cutting mats: Dedicated mats in two sizes (S and M) protect the tool and optimize performance.
- Magnifiers: A 5× magnifier can be mounted on either the standard holder or scale holder to precisely verify cutting positions.
With its combination of precision, versatility, and ease of use, the POLOS® Wafer Scriber is ideal for research labs and small-scale production environments requiring high-quality wafer preparation.
