POLOS HOTPLATE 350

Product description

The POLOS® Hotplate 350 is a high-performance, table-top hotplate designed for accurate thermal processing of larger substrates in research and pilot-scale production. Ideal for soft bake, hard bake, and curing of photoresist, epoxy, and other temperature-sensitive materials, it provides uniform, repeatable heating and a soft-close lid for safe, controlled operation.

Engineered for larger substrates

Capable of handling wafers and substrates up to 300 mm, the Hotplate 350 maintains precise temperature control across larger surfaces, delivering the same reliability and consistency as smaller models. It’s the perfect solution for labs working with bigger materials without sacrificing thermal precision.

Advanced features standard

The advanced Hotplate 350 comes fully equipped, including:

  • N₂ connection for inert atmosphere baking
  • Lifting pins for easy substrate manipulation
  • Vacuum bake capability
  • Proximity pins for non-contact processing

Flexible in-deck integration

With the optional in-deck display bracket, the Hotplate 350 can be quickly converted from a table-top unit to an in-deck installation, providing adaptability as your laboratory workflow evolves from research to semi-automated processes.

POLOS HOTPLATE 350

Choose your version:
Suitable for soft bake and hard bake processes
Designed with a soft-close lid
Easily convertible into an indeck model
Programmable storage of 20 programs
Including: lifting pins, vacuum bake and proximity pins

Specifications

Product Number
POLOS-HP350
Material
Aluminum (anodized) (Housing: Stainless Steel)
Max. Substrate size
Suitable for substrates up to 300 mm
VAC
Available in 110 VAC or 230 VAC
Temperature range
Temperature Range 50 - 230°C
Status
Request information