Mechanical wafer pick edge grip with spatula (WHS-G2) 100-125 mm

Mechanical wafer pick edge grip with spatula (WHS-G2) 100-125 mm

Product description

Applications:

  • Specialty wafer handling - General edge only handling of bonded, double topography, Taiko, optical, TSV, MEMS and other wafers that cannot be handled by a backside contact handling methods.
     
  • Standard handling - Manually transferring, sorting, and loading wafers in a wafer fab. Works for both silicon and compound wafers.
     
  • Inspection - Sample inspecting wafers for macro defects, particles, and scratches, which typically requires operators to inspect under specialized lighting.
     
  • Flat surface interface - Using the knife edge version to load and unload wafers from hotplates, platens, or vacuum chucks.
  • Economical handling tool - Used as cost-effective and portable alternative to a vacuum wands for general wafer handling applications; and as a replacement for tweezers which leave scratches behind.

A normally closed (consistent-force) edge exclusion mechanical pick for handling 100mm and 125mm round substrates from the wafer edge. This model features a knife-edge spatula tip for lifting the wafer from a flat surface or single wafer carrier. The gripper material is ESD-safe PEEK for longevity, antistatic properties, and general chemical resistance. The wafer contact pad is perfluorinated strip for grip hold on the wafer without scratching or leaving out-gassing behind. ISO Class 4

Mechanical wafer pick edge grip with spatula (WHS-G2) 100-125 mm

Choose your version:
Compound and thin wafer compatible
Normally-closed edge wafer handling
Knife-edge spatula model
Ergonomic safe wafer handling
Perfluorocarbon 3 mm front side touchpad
Antistatic material construction

Specifications

Product Number
WHS-G2-45
Material
Backside/gripper: Antistatic PEEK
Size
100-125 mm
Grip
Edge grip with spatula
ISO
ISO 4
Status
Request information