Mechanical wafer pick edge grip with spatula (WHS-G2)

Mechanical wafer pick edge grip with spatula (WHS-G2)

Product description

Applications:

  • Specialty wafer handling - General edge only handling of bonded, double topography, Taiko, optical, TSV, MEMS and other wafers that cannot be handled by a backside contact handling methods.
     
  • Standard handling - Manually transferring, sorting, and loading wafers in a wafer fab. Works for both silicon and compound wafers.
     
  • Inspection - Sample inspecting wafers for macro defects, particles, and scratches, which typically requires operators to inspect under specialized lighting.
     
  • Flat surface interface - Using the knife edge version to load and unload wafers from hotplates, platens, or vacuum chucks.
     
  • Economical handling tool - Used as cost-effective and portable alternative to a vacuum wands for general wafer handling applications; and as a replacement for tweezers which leave scratches behind.

A normally closed (consistent-Force) edge exclusion mechanical pick For handling 50 mm up to 200 mm round substrates from the wafer edge. The gripper material is ESD-safe PEEK For longevity, antistatic properties, and general chemical resistance. The wafer contact pad is perfluoro elastomer strip for grip hold on the wafer without scratching or leaving out-gassing behind. ISO Class 4.

Mechanical wafer pick edge grip with spatula (WHS-G2)

Choose your version:
Compound and thin wafer compatible
Normally-closed edge wafer handling
Knife-edge spatula model
Ergonomic safe wafer handling
Perfluorocarbon 3 mm front side touchpad
Antistatic material construction

Specifications

Product Number
WHS-G2
Status
Request information