The AT650P is a compact, table-top plasma ALD tool engineered for high-performance thin-film deposition in a small footprint. Its streamlined chamber design and minimal chamber volume enable fast cycling and enhanced exposure, making deep penetration processes achievable while maintaining precision and uniformity.
Compact, efficient, and cleanroom-ready
Designed for bench-top installation, the AT650P is fully cleanroom compatible. Its rapid cycle times and high plasma exposure allow for deep, uniform processing with minimal substrate damage. The system’s straightforward maintenance and low utility requirements make it an affordable and reliable plasma ALD solution.
Key features
- Small footprint desktop plasma ALD system
- Hollow cathode plasma source for high electron density and improved growth per cycle
- Low plasma-induced damage and minimal oxygen contamination (ideal for nitrides)
- Supports substrates up to 6" diameter (customizable chucks available)
- 3 organometallic precursor lines (heatable up to 185 °C), 1 at room temperature (upgradeable to 185 °C)
- Up to 4 oxidant/reductant lines
- High-temperature compatible fast-pulsing ALD valves with integrated ultrafast MFC for inert gas purge
- Substrate temperatures up to 400 °C
- High-exposure static processing mode for enhanced film conformality
Optional enhancements
- Customized chuck or platen designs
- Quartz Crystal Microbalance (QCM)
- Specialized bubbler configurations for your precursors
- Lead-lock or glovebox interface
- Additional counter-reactant lines with MFC control (up to 2 extra)
- Extra heated precursor lines up to 185 °C for a total of 4
- Fully customized system configurations available. Contact us to discuss your process needs
