High-temperature Polyimide vacuum wand tip for special handling of substrates to/from a platen, evaporator, hotplate or flat surface in a cleanroom environment. Features sharp edged profile with a shallow vacuum pocket designed for safely handling compound wafers. Press-fit type installation, includes tip, tubing and adapter - fully assembled. For handling of 50-100mm wafer substrates. ISO Class 3.
Vacuum tip polyimide 50-100 mm (WHS-V1) compound, knife edge (for compound wafers)
Vacuum tip polyimide 50-100 mm (WHS-V1) compound, knife edge (for compound wafers)
Choose your version:
Knife-Edge or Spatula for Platen Unloading
High-Temperature Polyimide
Tip Assembly - Tip, Tubing, Adapter
Specifications
Product Number
WHS-V1-PI2CST
Version of
Material
Polyimide
Size
50-100 mm
Type
Vacuum tip assembly
ISO
3
Status
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