Applications:

• Bake - Long term thermal bake applications where wafers are left in ovens for multiple days.
• Thin Wafer Handling - Thin wafer handling where sharp thin wafers cut into plastic cassettes.
• Thick Wafers - Bonded or thick wafer applications where industry standard plastic cassettes will not work due to slot dimensions.
• Ultrasonic and megasonic  - cleaning applications where open side wall stainless steel cassettes perform better than soundwave dampening plastic cassettes.

The M3 series is a high temperature stainless steel for 200 mm (8”) diameter wafers. SEMI compliant 25-slot, 6.35 mm (0.250”) pitch, 25.4 mm (1.00”) D1, 8° slot angle in the profile of an industry plastic cassette. Electro polished (EP) type 316 stainless steel.  For thermal automation processing, general bake applications up to 550°C; or mega- and ultra- sonic cleaning applications.