The POLOS^® Wafer Scriber is a high-precision, lab-scale tool designed to deliver exceptional edge quality during wafer cutting. Its ergonomic design ensures user comfort, while the integrated adjustable pressure dial enables consistent, precise scribing — without requiring manual pressure. Users can choose between a carbide or diamond cutting wheel, tailored to their specific materials and application needs.

Precision cutting

Strong magnetic guides are used for cutting substrates repeatedly in the same size. These precision magnetic guides enables the user to cut in an accuracy less than 0.1 mm. Using a caliper, it can further adjust and cut the substrate in an accuracy of ±50 μm.

The POLOS^® Wafer Scriber is ideal for cutting a wide range of materials, including: Glass and oxide-coated glass wafers (e.g., ITO, FTO, AZO glass) Quartz materials (fused quartz, wafers, plates, slides, coverslips) Silicon wafers Sapphire wafers and substrates Other crystalline substrates and wafers.

Optional tools

A specially designed film-cutting head can be used in place of the standard wheel cutter. For optimal protection and performance, use a dedicated cutting mat to prevent damage to the tool. The optional film cutting mat is available in two sizes (S and M). A dedicated 5x magnifier can be used with either a scale magnifier holder or a standard magnifier holder to accurately check the cutting position.