The POLOS® Print UV Standard is a maskless lithography equipment, based on a Digital Micromirror Device projection technology (DMD), compatible with a wide range of resists and substrates. This system can produce any 2D shapes at micron resolution without the need for a hard-mask.
Key features
- Writing resolution down to 1.5 µm
- Adjustable writing field and resolution with exchangeable objectives
- Compatible with CAD files or bitmap images
- Compatible with I, h and g-line photoresists
- Compatible with a wide range of substrates (silicon, glass, metal, plastic, ...)
- Compatible with any sample size up to 5” square masks
- Camera feedback for alignment steps
Key benefits
- Time and money saving thanks to the absence of a hardmask
- Intuitive alignment method with a direct overlay of the design on the sample
- Table-top, with a very small footprint
- Technology well suited for microelectronics, 2D-materials, microfluidics, optoelectronics, optics or any other 2D micro-fabrication applications
- Light source: Exposure: 385 nm; alignment: 590 nm
- Minimum feature size: 1.5 µm
- Alignment resolution: 2 µm
- Maximum exposure area: 70 x 70 mm2
- Substrate size: Up to 100 mm (4") wafers
- Writing speed: 75 mm2/min
- System dimensions: 52 (w) x 52 (h) x 69 (d) cm
Applications
- Microfluidics
- Microelectronics
- Optoelectronics
- Spintronics
- 2D Materials
- Biotechnologies
Options and accessories
- Multiple-sample holder (glass-slide, 4” wafer etc.)
- Objectives