POLOS

POLOS BEAM

POLOS BEAM

Product description

Maskless lithography removes the limitations of traditional photomasks, allowing patterns to be created instantly without the cost, lead time, or inflexibility of mask production. This makes it an ideal approach for research, development, and rapid design iteration.

POLOS® brings these advantages into a truly compact desktop platform, delivering high-performance maskless lithography without sacrificing resolution, speed, or usability.

At the heart of the system is the POLOS® Beam Engine, which projects submicron features directly onto the substrate. High-precision stepping enables accurate stitching across multiple exposure fields, allowing seamless patterning of substrates up to 6 inches in diameter.

Compact by design/strong>

A complete, professional maskless lithography solution in a footprint smaller than a typical desktop PC.

High-performance exposure

Achieves submicron feature resolution while exposing an entire write field in under two seconds.

Rapid autofocus

Closed-loop focus optics combined with piezo actuators bring the system into focus in under one second, ensuring sharp, repeatable results.

Effortless multilayer alignment

Semi-automatic alignment tools allow multilayer processes to be completed in just minutes, even for complex designs.

Intuitive software workflow

Patterning is fast and straightforward: simply load your design, align the substrate, and expose. The user interface follows familiar CNC-style navigation, making operation intuitive even for new users.

POLOS

POLOS BEAM

Sub-micron resolution while exposing a write field in less than two seconds
Semi-automatic alignment for completed multilayer alignment within minutes
Equipped with a 405 nm Engine and 20x objective
Ultrafast Autofocus

Specifications

Brand
POLOS
Product Number
Beam Maskless Lithography System
Max substrate size
106 x 106 mm
Wavelength
405 nm
Resolution
0.8 µm
System type
Table-top system
Status
Request information