POLOS

POLOS BEAM XL

POLOS BEAM XL

Product description

Maskless lithography offers a convenient way to create nanopatterns without the use of slow and expensive photomasks. This is particularly useful for research and rapid prototyping purposes. The POLOS® Beam is a budget compact solution that brings these benefits to your desktop without compromising on performance.

The POLOS® Beam Engine is a quick-swappable component that uses a UV laser beam to create a precise spot that can expose any pattern on a photoresist. To expose large wafers, precision steppers move the wafer, and multiple exposures are stitched together. The POLOS® Beam Engine can produce features smaller than (CD) 0.8 μm on a 6" wafer when equipped with a 405 nm Engine and 20x objective.

Compact

Full-featured maskless lithography, smaller than a desktop computer.

Powerful

Sub-micron resolution while exposing a write field in less than two seconds.

Ultrafast Autofocus

Piezo-actuators reach focus in less than a second when combined with our close-looped focus optics.

No-fuss Multilayer

Semi-automatic alignment allows multilayer alignment to be completed within minutes.

The included software makes quick work of any patterning job; just load, align and expose. Navigation is similar to CNC systems.

 

POLOS

POLOS BEAM XL

Sub-micron resolution while exposing a write field in less than 2 seconds
Semi-automatic alignment for completed multilayer alignment within minutes
Equipped with a 405 nm Engine and 20x objective
Ultrafast Autofocus
Backside Alignment optional

Specifications

Brand
POLOS
Product Number
POLOS® BEAM XL Mk2
Max substrate size
150 x 150 mm
Wavelength
405 nm
Resolution
0.8 µm
Status
Request information