POLOS

POLOS BEAM XL

POLOS BEAM XL

Product description

Maskless lithography offers on-demand nanopatterning, removing the need for expensive and time-consuming photomasks. The POLOS® BEAM XL builds on this capability, providing a compact, desktop-ready platform without sacrificing performance, making it perfect for research, prototyping, and small-scale production.

At the heart of the system, the POLOS® Beam Engine projects precise submicron patterns directly onto your substrates. Advanced precision steppers enable smooth stitching across multiple write fields, allowing exposure of substrates up to 6 inches (150 mm) in diameter.

  • Compact Design: Full-featured maskless lithography in a footprint smaller than a standard desktop computer.
  • High Performance: Submicron resolution with write fields exposed in under two seconds.
  • Rapid Autofocus: Piezo-actuated focusing achieves perfect alignment in less than a second using closed-loop optics.
  • Easy Multilayer Alignment: Semi-automatic alignment streamlines multilayer processes, enabling completion in minutes.

The included user-friendly software simplifies patterning workflows. Load your design, align the substrate, and start exposure with intuitive controls similar to CNC navigation, making complex nanopatterning fast and accessible.

POLOS

POLOS BEAM XL

Sub-micron resolution while exposing a write field in less than 2 seconds
Semi-automatic alignment for completed multilayer alignment within minutes
Equipped with a 405 nm Engine and 20x objective
Ultrafast Autofocus
Backside Alignment optional

Specifications

Brand
POLOS
Product Number
POLOS® BEAM XL Mk2
Max substrate size
150 x 150 mm
Wavelength
405 nm
Resolution
0.8 µm
System type
Table-top system
Status
Request information