AT650P ALD System

AT650P ALD System

Product description

The AT650P is a small footprint desktop plasma ALD tool with a streamlined chamber design and small chamber volume, while also offering fast cycling capability and high exposure for deep penetration processing.

The AT650P has a small footprint bench-top installation and is fully cleanroom compatible. Its fast cycling capability and high exposure make deep penetration processing possible. Due to its simple system maintenance and low utilities cost, this tool is a very cost effective desktop plasma ALD system.

Features

  • Small Footprint Desktop Plasma ALD
  • Now with a Hollow Cathode source
    • Improved growth per cycle
    • High electron density
    • Low plasma damage
    • Less oxygen contamination (in nitrides)
  • Affordable Plasma ALD at the cost of thermal system
  • Accommodates samples of 6" diameter with optional customizable chucks
  • 3 organometallic sources (can be heated to 185°C), 1 at RT (upgradeable to 185°C) and up to 4 oxidant/reductant sources.
  • High temperature compatible fast pulsing ALD valves with ultrafast MFC for integrated inert gas purge - standard
  • Substrate temperature to 400°C
  • High exposure available with static processing mode

Options

  • Customized chuck/platen
  • QCM (Quartz Crystal Microbalance)
  • Bubbler design for your bottles
  • Lead-lock (or glovebox interface)
  • Counter-reactant line (MFC controlled) (up to 2 additional)
  • Additional heated precursor line to 185 CC for 4 total
  • Customized systems available. Contact us for more information

AT650P ALD System

Plasma ALD at the cost of a thermal system
Warm walled aluminum chamber
High exposure available with static processing mode
Simple system maintenance and low utilities cost

Specifications

Product Number
AT650P
Max. substrate size
6" (150 mm)
Max. temperature
Up to 400°C
System type
Bench-top system
Status
Request information