Spin Coater Drying

The POLOS spin coaters have proven to be an excellent cleaning, rinsing and drying solution after wafer processing.

Please find below our cost-effective POLOS SPIN150i and POLOS SPIN200i spin processors for spin drying. With a low contact mechanical chuck no vacuum line or vacuum pump is required.


  • Single Wafer Chemical or Residual Removal
  • Spin, Rinse, and Dry semiconductor wafers after a wet process
  • Cleaning up to 300mm wafers utilizing DI Water Rinse, followed by heated N2 dry


  • Use Low Contact Chuck (non-vacuum chuck) only the edge of the substrate is in contact with the chuck

Recommended models*:

  • Up to 150mm: SPIN COATER SPIN150i-NPP
  • Up to 200mm: SPIN COATER SPIN200i-NPP
  • Up to 300mm: SPIN COATER POLOS 300 Advanced NPP
* Models are standard supplied with vacuum chuck, mechanical chucks are optionally available, depending on substrate.

Note: For batch applications: We offer refurbishment services of your SRD Spin Rinse Dryers.

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