The MDA-400M is a high-precision mask aligner designed for research institutions seeking advanced lithography capabilities. This system allows researchers to develop and optimize processes on small substrate samples or full wafers up to 4” in diameter.
The manual-control MDA-400M features a versatile UV light source (350–450 nm, 365 nm standard) with an intensity of 20–30 mW/cm² and a beam size of 6.25” × 6.25”, providing 3% uniformity across 4” wafers. The aligner includes an automatic exposure system and a Dual CCD zoom microscope with a 19” LCD monitor, offering magnification from 5× to 20× for precise sample inspection.
Contact modes include Soft, Vacuum, Hard, and Proximity, with Vacuum and Hard contact fully adjustable. Alignment accuracy is better than 1.0 micron, ensuring high-quality, repeatable results.
Optional upgrades
- Anti-vibration table for enhanced stability
- UV intensity meter for precise control
- UV-LED (365 nm) exposure module
