Our all NEW table-top hotplate is a versatile and affordable tool for R&D and pilot lines. It is designed with a soft-close lid and is suitable for soft bake as well as hard bake processes, and curing of photoresist, epoxy or any other work requiring precise temperature control. The POLOS:reg; Hotplate 200 is also available as an advanced version. The advanced unit is standard equipped with complimentary features such as an N2 connector, lifting pins, vacuum bake, and proximity pins.

Easily convertible into an indeck model

Using our specially designed indeck bracket and display bracket, you can easily convert the POLOS® hotplate into an indeck solution. 

HOTPLATE 200 Advanced

• Heater surface area 220 x 220 mm
• Suitable for 1 x 200 mm wafer
• Temperature range 50 - 230°C
• Programmable storage of 20 programs (Temperature/Time)
• Countdown timer (1 - 999 sec.)
• Temperature uniformity ±1°C
• Equipped with programmable (electric) lifting pins set in radius of 82 mm
• Equipped with proximity pins to hold the wafer above the heating plate while baking
• Equipped with perforated vacuum plate to realize a hard contact bake
• Voltage: 230 or 110 VAC
• Heater block material: Aluminum (anodized)
• Housing material: Stainless steel
• Including soft-close lid with N2 connection
• Weight: 12 kg
• Dimensions: approx. 422 x 295 x 201 mm