AT610 ALD System

AT610 ALD System

Product description

The AT610 is a high-performance, table-top ALD system designed for precision thin-film deposition on larger substrates up to 6" (150 mm) round or 7" square. Its temperature-controlled all-aluminum chamber reaches up to 330 °C, offering uniform heating and excellent reproducibility. Perfect for R&D and pilot-scale production, the AT610 delivers capabilities comparable to larger commercial systems while remaining compact, easy to use, and cost-effective.

High-fidelity precursor delivery

The AT610 minimizes process variability with precise, volume- and valve-controlled precursor dosing. Fast cycle rates of 6–10 cycles per minute (up to 1.2 nm/min for Al₂O₃) ensure efficient, high-quality film growth, making it a best-in-class solution for demanding ALD applications.

System features

  • Supports substrates up to 6" diameter (150 mm) or 7" square
  • Chamber temperature range: RT to 400 °C ±1 °C
  • Precursor temperature: RT to 150 °C ±2 °C (optional heating jackets)
  • Standard configuration: 2 counter-reactants, 1 liquid source (H₂O/H₂O₂), 1 gas source (O₂/NH₃); up to 2 gas sources supported
  • Variable process pressure: 0.1–1.5 Torr
  • All-metal sealed system upstream of the sample
  • Up to 3 heated precursor sources with integrated dose volumes
  • Volume- and time-controlled dosing for repeatable results
  • Point-source gas distribution for superior uniformity and high conformality
  • Heated chamber isolation valve for advanced exposure control
  • Fully automated temperature control for bottles, dose volumes, precursor manifold, and chamber
  • 4 Swagelok thermal ALD valves and 5 high-temperature fill valves
  • Fujikin metal-sealed MFC (200 sccm) for N₂ or Ar purge
  • Integrated angled HMI with PLC control, 7" 16-bit color touchscreen
  • Preloaded, proven process recipes embedded in proprietary PLC software

Precision and Reliability

The AT610 is engineered for repeatable, high-conformality films with fully automated temperature and precursor control. Its all-metal-sealed architecture and optimized precursor flow paths ensure consistent results while maintaining safe, easy operation and low maintenance requirements.

AT610 ALD System

Suitable for up to 5 lines
Large substrate and precursor temperature ranges
Fast cycling capability
Glovebox integration optional

Specifications

Product Number
AT610
Max. substrate size
6" (150 mm)
Max. temperature
Up to 330°C
System type
Table-top system
Status
Request information

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