AT610 Base ALD System
Temperature-controlled all aluminum chamber, up to 330°C, with up to 6" round and 7'' square diameter sample holder. Table-Top Atomic Layer Deposition Unit, suitable for up to 5 lines. The tool boasts capabilities that meet or exceed those found in other tools on the market, while being easy to use and maintain - at a cost well below what can be found on the market today.
- Reduces process and dose variability common to competitors
- Fast cycling capability
- 6-10 cycles/min or up to 1.2nm/min Al2O3 (best in class)
Features:
- Substrate size Up to 6" (150mm) diameter
- Chamber temperatures from RT to 400°C ± 1°C
- Precursor temperatures from RT to 150°C ± 2°C with optional heating jackets
- 2 counter reactants - standard
- 1 liquid source such as H2O or H2O2
- 1 gas source such as O2 or NH3
- 2 gas sources can be used as well
- Variable process pressure control 0.1 to 1.5Torr
- All metal sealed system upstream of sample
- Up to 3x Heated sources
- Volume controlled dosing (Volume control yields more repeatable precursor doses)
- Valve time controlled dosing
- Exposure Control
- Point source Gas Distribution with Optimal Spreading for superior film uniformity
- Integrated, angled HMI/PLC SW/Controls (prevents random SW lockups)
- 16-bit 7" color touchscreen control and PLC operation
- Recipe Control: proven recipes pre-loaded in controller
- Heated chamber isolation valve for high exposure, high conformality processes
- Dedicated process kit with optimized precursor flow path and all metal sealing upstream of sample
- All sources include heated, integrated dose volumes for precise and quantifiable precursor delivery
- 4 Swagelok thermal ALD valves
- 5 high temperature dose volume fill valves
- Fujikin metal sealed, 200 sccm MFC for N2 or Ar purge flow control
- Fully automated temperature control system for bottles, dose volumes, precursor delivery manifold and chamber
- Chamber heater control based on dual temperature probes for accuracy and as probe failure failsafe
- Proprietary software embedded in PLC with integrated process recipe
